The electrostatic chuck (ESC) is a device primarily used in display manufacturing processes that utilizes electric fields to secure objects.

1. Principle and Structure of the Display Electrostatic Chuck

• Principle: The electrostatic chuck generates static electricity by applying voltage between two electrodes. This static electricity creates electrostatic forces between the chuck surface and the wafer, securing the wafer firmly in place.
• Structure:
• Electrodes: Typically made of metal or conductive materials and embedded within the chuck.
• Insulating Layer: Serves to protect the electrodes and provide electrical insulation.
• Surface Coating: The part that comes into direct contact with the wafer, designed to optimize friction and electrostatic generation.

2. Types of Electrostatic Chucks

• Coulomb Type Electrostatic Chuck: Utilizes basic electrostatic forces to hold the wafer in place. It has a simple structure and low production cost but requires high voltage.
• Johnsen-Rahbek Electrostatic Chuck: In addition to the electric field, it uses a special coating on the contact surface to increase adhesion. It can provide high clamping force even at low voltage and is more stable.

Electrostatic chucks play a crucial role in advanced manufacturing processes that require high precision. By securing and positioning wafers accurately, they significantly enhance the efficiency and quality of the manufacturing process.