The Gold Sleeve is a precision cylindrical or bushing-type metal component with gold plating, serving as a core thermal control part in semiconductor RTP (Rapid Thermal Processing) systems.

The sleeve fundamentally functions as:

A structural component that supports and guides a shaft or pin

A surface-plated part to ensure electrical contact stability and corrosion resistance

The RTP lamp Gold Sleeve is a high-precision reflective component applied to the lamp module of semiconductor equipment.

Utilizing the superior infrared (IR) reflectivity of gold plating, it efficiently concentrates radiant heat emitted from the lamp toward the wafer, while maintaining stable performance under high-temperature and vacuum environments.

Key Features

High-reflectivity gold plating (maximized IR reflection efficiency)

Micron-level precision machining to ensure lamp alignment accuracy and thermal uniformity

Excellent adhesion and high-temperature reliability based on Ni under plating

Designed for high-temperature thermal cycling environments